HP & AMD Scholarship Awards 2008

HP and AMD is offering non bond scholarship to undergraduates and postgraduates. This scholarship is opened for part time students as well.
The scholarship application submission duration is from 11 August 2008 to 30 September 2008.

Successful recipients will each receive a scholarship package worth RM25,000.

For more information, please visit here

1 comment:

Jayanthi said...

May I know when is the advertisement for HP & AMD scholarship for the year 2010?
Thank you.